IDF 2009 roundup: New directions for Intel
Published: 24 Sep 2009 13:00 BST
At the annual Intel Developer Forum in San Francisco this week, the chipmaker showed off its latest processor developments — including a silicon wafer housing 22nm chips — and outlined its plans to adapt to the growing range of computing devices, from netbooks to in-car systems.
ZDNet UK has all the news, plus photos, videos, and blogs from our editor on the ground, Rupert Goodwins.
Intel aims to make fibre optics mainstream
The chipmaker hopes its Light Peak project will bring fibre-optic speeds to ordinary computer users, and USB is the logical path to get there [29 Sep 2009]
Geekender Gallery: IDF 2009
Check out the technology that attracted our on-the-spot editor, Rupert Goodwins, at IDF in San Francisco [25 Sep 2009]
Smart signs and digital slot machines at IDF
Executive vice president Sean Maloney demonstrates a new digital billboard and virtual slot machine that can be remotely managed and reprogrammed using vPro processor technology [24 Sep 2009]
Intel shows off super-slim laptops at IDF
At this week's Intel Developer Forum in San Francisco, the chipmaker revealed a number of svelte laptops [24 Sep 2009]
Intel predicts imminent SSD mass adoption
IDF 2009: Although hard disks are generally more economical, a pricing breakthrough may bring SSDs to the corporate desktop in large numbers, according to the chipmaker [24 Sep 2009]
Intel's Light Peak aims to replace today's cables
IDF 2009: Intel wants to replace today's multitude of copper cables with a single type of optical connection, and hopes standardisation will help it catch on [24 Sep 2009]
Intel brings Nehalem to notebooks
IDF 2009: Processor chief Dadi Perlmutter touts a new fibre-optic replacement for video, audio and network leads [24 Sep 2009]
Images: New technology unveiled at IDF 2009
At the annual Intel Developer Forum, the chipmaker shows off technology including a 22nm wafer, the new Larrabee graphics chip and the Sandybridge processor family [23 Sep 2009]
Intel shows off new 22nm wafer
IDF 2009: Intel chief executive Paul Otellini shows off a silicon wafer housing chips made with 22nm process technology [23 Sep 2009]
Intel: Chips will meet the needs of new datacentres
IDF 2009: Chip business chief Sean Maloney outlines Intel's plans for processors that will meet the changing demands of datacentres [23 Sep 2009]
Intel invites developers to write apps for Atom
The chipmaker has set up a developer programme in a bid to have more applications written for small-screened systems running on its low-power processor [23 Sep 2009]
Intel shifts focus as tech moves beyond the PC
IDF 2009: Innovation needs to meet changing computing demands arising from netbooks, mobile phones and in-vehicle devices, Intel chief Paul Otellini tells developers [23 Sep 2009]
IDF 2009: Intel demos Moblin
Intel product manager Claire Alexander shows chief executive Paul Otellini a demo of the Linux-based, open-source operating system Moblin [23 Sep 2009]
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