Intel, Samsung team up for next-gen silicon wafers
Reuters
Published: 06 May 2008 09:02 BST
Samsung Electronics, the world's top maker of memory chips, on Tuesday said it would co-operate with chief rivals Intel and Taiwan Semiconductor Manufacturing Company to develop next-generation, larger silicon wafers to boost efficiency in chip manufacturing.
Samsung said in a filing that it would work with US-based Intel, the world's top maker of semiconductors, and Taiwan's Taiwan Semiconductor Manufacturing Company (TSMC), the world's largest contract chipmaker, to help migration of manufacturing standards from the current 12-inch silicon wafers to 18-inch discs that would yield more than double the number of chips.
The South Korean company said the co-operation plan called for a first pilot line to be operable by 2012.
The world's largest chipmakers have been exploring the move to pizza-sized silicon wafers to help them grab market share as demand surges for gadgets such as Apple's iPod.
"Increasing cost due to the complexity of advanced technology is a concern for the future," Mark Liu, TSMC's senior vice president of advanced technology business, said in a statement.
"Intel, Samsung, and TSMC believe the transition to [18-inch] wafers is a potential solution to maintain a reasonable cost structure for the industry," said Liu.
The size of the wafer is critical to make production more efficient. A new generation of larger wafers typically comes out each decade or so.
The group is planning to co-operate with the whole semiconductor industry in order to establish common standards through the International Sematech Manufacturing Initiative (ISMI) consortium.
Still, some analysts say cost is a major hurdle and the industry — from semiconductor makers to the companies that make their equipment — needs to agree on how to proceed.
A factory designed to make chips on 18-inch wafers could cost $10bn (£5.1bn) or more to build, nearly triple the price of a current 12-inch wafer factory.
Only the biggest companies, like Intel, Samsung and TSMC, have the resources to be the first adopters of the new technology, while smaller chipmakers, such as those in China, are unlikely to buy into the expensive plan soon, analysts said.
Did you find this article useful?
5 out of 5 people found this useful
- Share this article:
