Advertisement
Promo

Processors Toolkit

Breakthrough promises hotter, tougher, faster chips

Rupert Goodwins ZDNet.co.uk

Published: 26 Aug 2004 16:30 BST

  • Email
  • Trackback
  • Clip Link
  • Print friendly
  • Post Comment

Powerful processors that run hot but need no cooling and devices capable of withstanding extreme environments may be the result of new research reported today in Nature, the science journal.

Researchers led by Daisuke Nakamura of Toyota Central R&D Laboratories Inc. of Aichi, Japan, have described a way to build up very low defect wafers of silicon carbide (SiC), an essential step in mass-producing electronic devices from the compound. The researchers said it may be up to six years before the process is commercialised.

The new process involves building up layers of SiC from a high temperature gas, allowing the crystallisation of the compound to happen only on the cleanest faces. By this method, the researchers say, wafers can be made with levels of defect factors of two to three times fewer than previously.

"This has been an immense challenge for many years, and it will have major implication for society," Nick Wright, an electronics expert at the University of Newcastle upon Tyne, told Nature. New applications including much more efficient control of domestic equipment and engines running at high temperatures will be possible, he said. Experimental SiC transistors developed by the Japanese National Institute of Advanced Industrial Science and Technology have shown much lower power loss, better efficiency and high voltage capabilities than their silicon counterparts.

SiC -- also known as carborundum -- is a semiconductor, but its use in electronics has been restricted because of its extreme toughness. With a melting point of 2,700 degrees Celsius, twice that of silicon, and a hardness close to diamond, it has proved almost impossible to work with. The only mass-market electronic devices to use it so far have been some types of blue LED and laser diodes, with diodes and transistors beginning to appear. World production of SiC wafers last year was around 250,000 wafers, according to market research company Yole Développement.

  • Email
  • Trackback
  • Clip Link
  • Print friendlyPrint with EPSON

Did you find this article useful?
50 out of 106 people found this useful


Full Talkback thread

0 comments

Company/Topic Alerts

Create a new alert from the list below:






Video icon

Video

Discussions

roger andre roger andre

Taking Out the Skype Garbage

Saturday 14 November 2009, 8:48 PM

3 comments
muller6 muller6

Excuse

Saturday 14 November 2009, 7:09 PM

1 comment
Tezzer Tezzer

Mandriva One 2010.0 (including Moblin...

Saturday 14 November 2009, 7:01 PM

5 comments
kamxsd kamxsd

Ericsson Marconi OMS 1600 kit lost by...

Saturday 14 November 2009, 6:40 PM

1 comment

Skip Sub Navigation Links to CNET Brand Links

Help

Become part of the ZDNet community.

Newsletters